新突思曾在EW2024展会上推出SL系列MPU，发布了新突思Astra™原生 AI计算平台。该平台专为物联网设备边缘计算打造，结合了可扩展的低功耗计算芯片、开源软件及工具套件，以及Veros™无线连接方案。平台的研发基于新突思在物联网领域的神经网络、过硬的AI硬件及编译器设计经验，并结合公司内部对多种技术模态的全方位支持。

WPG Holdings' member, Silicon Applications Group Corp, is a founding partner of Axelera AI’s new global Partner Accelerator Network, supporting edge AI solution development.

We're thrilled to announce our presence at Computex 2025, where our groundbreaking on-device AI solutions will be showcased not just at our booth, but across an impressive lineup of partner exhibits throughout the venue! What does it mean when over 10 leading hardware manufacturers choose to feature DEEPX technology in their own booths? It's a powerful validation of our reliability-first approach to AI innovation. After rigorous testing with more than 300 global enterprises through our Early Engagement Customer Program, our AI chips have consistently proven its exceptional capabilities. 💡These industry leaders recognize what sets DEEPX apart: - Advanced Thermal Efficiency - GPU-level of AI Accuracy - Unmatched AI Performance - Industry-Leading TCO Particularly noteworthy is our strong adoption among Industrial PC manufacturers - partners who operate in the harshest environments where failure is simply not an option. Our partnership network throughout the exhibition is a testament to how DEEPX is becoming the trusted foundation for AI applications. Visit DEEPX at booth 4F, L0409 during May 20-23 at Taipei Nangang Exhibition Center to witness firsthand how we're setting new standards for reliable on-device AI.

NXP’s i.MX-8M+ and i.MX-95 application processors both have NXP’s NPU on chip. The i.MX-95 can handle inference for LLMs below around 4 billion parameters in automotive, industrial and smart appliance applications. For bigger LLMs, an external accelerator chip is required.