VD55H1 iToF特點:
_ Ultra-compact 0.54 Mpix iToF sensor die
• 672 x 804 indirect Time-of-Flight (iToF) sensor die (0.54 Mpixel)
• 4.6 μm backside illuminated (BSI) fast photodiode pixel, 1/4’’ optical format
• 4.5 mm x 4.9 mm die manufactured on advanced 40 nm stacked wafer technology
_實現低功耗、高精度深度圖
• Pixel with >85% demodulation contrast at 200 MHz modulation frequency
• Low noise charge domain pixel (kTC free) < 5e-
• 支援多頻率(up to three frequencies)
• 感測器平均耗電量低至 80 mW
• Smart iToF modulation, no need for wiggling error calibration
• Multi-user interferences reduction
• Optimized for low EMI/EMC
_Easy integration for 3D camera
• Raw data output on MIPI CSI2 interface at 1.5 GHz (quad or dual lane)
• 10/12-bit configurable ADC resolution
• Sensor raw output up to 120 fps (depth-level frame rate)
• 感測器控制: Fast mode+ I2C slave interface (up to 1 MHz)
• Laser driver interface: LVDS and 3-wire SPI
• 可用於深度重建的軟體ISP
應用
• 房間測繪和物件掃描可增強擴增實境使用者體驗
• 精確的深度分割,實現專業的散景相機效果 (Precise depth segmentation for professional bokeh camera effects)
• 用於支付和手機解鎖的安全人臉驗證 (Secure face authentication for payment and phone unlocking)
• 手勢識別 (Gesture recognition)
• 行動裝置
• AR/VR (AR/VR headsets)
• 消費機器人 (Consumer robots)
3D-iToF sensor for PC applications
_ Ultra-compact 0.54 Mpix iToF sensor die
• 672 x 804 indirect Time-of-Flight (iToF) sensor die (0.54 Mpixel)
• 4.6 μm backside illuminated (BSI) fast photodiode pixel, 1/4’’ optical format
• 4.5 mm x 4.9 mm die manufactured on advanced 40 nm stacked wafer technology
_實現低功耗、高精度深度圖
• Pixel with >85% demodulation contrast at 200 MHz modulation frequency
• Low noise charge domain pixel (kTC free) < 5e-
• 支援多頻率(up to three frequencies)
• 感測器平均耗電量低至 80 mW
• Smart iToF modulation, no need for wiggling error calibration
• Multi-user interferences reduction
• Optimized for low EMI/EMC
_Easy integration for 3D camera
• Raw data output on MIPI CSI2 interface at 1.5 GHz (quad or dual lane)
• 10/12-bit configurable ADC resolution
• Sensor raw output up to 120 fps (depth-level frame rate)
• 感測器控制: Fast mode+ I2C slave interface (up to 1 MHz)
• Laser driver interface: LVDS and 3-wire SPI
• 可用於深度重建的軟體ISP
應用
• 房間測繪和物件掃描可增強擴增實境使用者體驗
• 精確的深度分割,實現專業的散景相機效果 (Precise depth segmentation for professional bokeh camera effects)
• 用於支付和手機解鎖的安全人臉驗證 (Secure face authentication for payment and phone unlocking)
• 手勢識別 (Gesture recognition)
• 行動裝置
• AR/VR (AR/VR headsets)
• 消費機器人 (Consumer robots)
3D-iToF sensor for PC applications
3D use-cases in PC / Gaming / Accessories / TV
VD55H1_兩種照明參考設計,可實現最佳用例匹配
> 2 illumination ref designs
3D 物件掃描示意圖
Computational photography
Segmentation, background removal, Bokeh, Portrait relighting, etc
Room mapping
評論