ST 意法半導體推出具有 200 MHz 調變的低雜訊、低功耗 0.54 Mpix、3D iToF 感測器晶片

VD55H1 iToF特點:  

_ Ultra-compact 0.54 Mpix iToF sensor die

• 672 x 804 indirect Time-of-Flight (iToF) sensor die (0.54 Mpixel)

• 4.6 μm backside illuminated (BSI) fast photodiode pixel, 1/4’’ optical format

• 4.5 mm x 4.9 mm die manufactured on advanced 40 nm stacked wafer technology


_實現低功耗、高精度深度圖

• Pixel with >85% demodulation contrast at 200 MHz modulation frequency

• Low noise charge domain pixel (kTC free) < 5e-

• 支援多頻率(up to three frequencies)

• 感測器平均耗電量低至 80 mW

• Smart iToF modulation, no need for wiggling error calibration

• Multi-user interferences reduction

• Optimized for low EMI/EMC


_Easy integration for 3D camera

• Raw data output on MIPI CSI2 interface at 1.5 GHz (quad or dual lane)

• 10/12-bit configurable ADC resolution

• Sensor raw output up to 120 fps (depth-level frame rate)

• 感測器控制: Fast mode+ I2C slave interface (up to 1 MHz)

• Laser driver interface: LVDS and 3-wire SPI

• 可用於深度重建的軟體ISP


應用

• 房間測繪和物件掃描可增強擴增實境使用者體驗

• 精確的深度分割,實現專業的散景相機效果 (Precise depth segmentation for professional bokeh camera effects)

• 用於支付和手機解鎖的安全人臉驗證 (Secure face authentication for payment and phone unlocking)

手勢識別 (Gesture recognition)

• 行動裝置 

• AR/VR  (AR/VR headsets)

• 消費機器人 (Consumer robots)


3D-iToF sensor for PC applications



3D use-cases in PC / Gaming / Accessories / TV




VD55H1_兩種照明參考設計,可實現最佳用例匹配

>  2 illumination ref designs



3D 物件掃描示意圖



Computational photography
Segmentation, background removal, Bokeh, Portrait relighting, etc




Room mapping




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參考來源

ST意法半導體: https://www.st.com/en/imaging-and-photonics-solutions/vd55h1.html

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